Industry | 2019.05.02
SST Vacuum Reflow Systems Launches Automated Vacuum Pressure Soldering System
Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging, announced that SST Vacuum Reflow Systems, a wholly owned subsidiary of Palomar Technologies, has launched the SST 8300 Series Automated Vacuum Pressure Soldering System. The series, consisting of single and triple chamber systems provides a highly reliable solder connection with a better than industry standard void rate – a key to delivering high-reliability power modules for automotive and commercial applications.
(PRWeb May 02, 2019)
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