Industry | 2014.02.26
Research and Markets: The Multi-Component IC Packaging Market 2014 Edition
DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/nm5tf6/the) has announced the addition of the "The Multi-Component IC Packaging Market 2014 Edition" report to their offering. Complex multi-component packages have added a new dimension to high speed and small form factor, and have been game changers for the industry. It is the package of the integrated circuit (IC) which holds the footprint to the printed circuit board (PCB), and thus it is the IC packag
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