Industry | 2015.09.17
SUSS MicroTec Launches XB8 - a New Semi-Automated High-Force Wafer Bonder
GARCHING, Germany--(BUSINESS WIRE)--SUSS MicroTec, a global supplier of equipment and applications for the semiconductor industry and related markets, has launched the new bonding platform XB8 today. The XB8 wafer bonder is designed for a wide range of bonding processes. It supports substrates with a wafer size of up to 200 mm. Key process parameters can be adjusted in a wide range, which makes the system ideal for advanced process development. In a production environment, the high level of aut
For more information, please visit
http://www.businesswire.com/news/home/20[...]B8---Semi-Automated-High-Force
