GENEVA--(BUSINESS WIRE)--At the Geneva International Motor Show 2016, HARMAN International Industries, Incorporated (NYSE: HAR), the premier connected technologies company for automotive, consumer and enterprise markets, will demonstrate its LIVS Connected Car Compute Platform for advanced, holistic vehicle intelligence with vehicle-to-x capability (V2X) based on RoadLINKTM technology from NXP Semiconductors N.V. (NASDAQ:NXPI). The wireless technology significantly improves road safety by alert
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