Industry | 2016.04.06
AIM to Highlight M8 at SMTA Intermountain (Boise) Expo & Tech Forum on April 7th, 2016
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce they will highlight their revolutionary M8 solder paste along with their full line of solder assembly materials at the 2016 SMTA Intermountain (Boise) Expo and Tech Forum, scheduled to take place April 7th, 2016 at the Boise State University located in Boise, Idaho. In addition, AIM’s Technical Marketing Manager, Timothy O’Neill will present his white paper, “A Practical Guide to Optimizing Solder Paste Performance for Ultra-Fine Feature Printing” at the expo from 9:15am – 10:00am.
(PRWeb April 05, 2016)
Read the full story at http://www.prweb.com/releases/2016/04/prweb13314819.htm
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http://www.prweb.com/releases/2016/04/prweb13314819.htm
