Industry | 2017.07.17
AIM’s White Paper Gets Published by the Journal of Electronics Material
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that its white paper “Effect of Ag, Ni and Bi Additions on Solderability of Lead-Free Solders,” written by Dr. Mehran Maalekian, R&D Manager, was recently published by the Journal of Electronics Materials, a highly reputable journal within the electronics industry.
(PRWeb July 17, 2017)
Read the full story at http://www.prweb.com/releases/2017/07/prweb14504798.htm
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