Technology | 2010.01.11
Rudolph Technologies Receives Multiple System Orders from STATS ChipPAC for eWLB Inspection
FLANDERS, N.J.--(BUSINESS WIRE)--Rudolph Technologies, Inc. (NASDAQ: RTEC), a worldwide leader in process characterization solutions for the semiconductor manufacturing industry, announced today that it has received multiple orders for its NSX® and WaferScanner™ Inspection Systems from STATS ChipPAC Ltd. The systems will be used for high-throughput inspection during each step of the eWLB (embedded wafer-level ball grid array) process. Shipments commenced in 4Q09 and will continue thro
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