Technology | 2010.08.31
SEMATECH Completes Fully Integrated 300mm Line for Via-Mid 3D ICs at UAlbany NanoCollege
ALBANY, N.Y.--(BUSINESS WIRE)--In another step towards driving the maturity of 3D IC integration, SEMATECH’s 3D Interconnect program announced today the completion of its 300mm 3D IC pilot line, operating at the College of Nanoscale Science and Engineering’s (CNSE) Albany NanoTech Complex. Dedicated to via-mid 3D applications, SEMATECH’s development and exploratory platform includes all processes and test vehicles necessary to demonstrate the viability of the via-mid technology in conjunction wi
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