Technology | 2015.09.02
Research and Markets: Global High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends 2015
DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/b6h7hj/highdensity) has announced the addition of the "High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends" report to their offering. The explosion of applications in the consumer and mobile space, internet of things (IoT) and the slowdown of Moore\'s law have been driving many new trends and innovations in packaging. The semiconductor industry now has to focus on system sc
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